solder dip

См. также в других словарях:

• Dip soldering — apparatus. Dip soldering is a small scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not… …   Wikipedia

• Solder wick — A solder wick (also desoldering wick or desoldering braid) is a tool for removing solder from any solder joint. Usually, it is a roll of fine, braided 40 or 42awg. wire, typically oxygen free copper, which has been treated with a rosin solder… …   Wikipedia

• dip solder — verb solder by immersion in a bath of molten solder • Hypernyms: ↑solder • Verb Frames: Somebody s something …   Useful english dictionary

• Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… …   Wikipedia

• Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …   Wikipedia

• Selective soldering — is the process of selectively soldering components to printed circuit boards, molded modules, etc. that could be damaged by the heat of a reflow oven in a traditional SMT assembly process. Consequently this process usually follows an SMT oven… …   Wikipedia

• ГОСТ 17325-79: Пайка и лужение. Основные термины и определения — Терминология ГОСТ 17325 79: Пайка и лужение. Основные термины и определения оригинал документа: 57. Абразивно кавитационное лужение Ультразвуковое лужение припоем, содержащим частицы твердого материала Определения термина из разных документов:… …   Словарь-справочник терминов нормативно-технической документации

• Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

• Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

• Gold — This article is about the metal. For the color, see Gold (color). For other uses, see Gold (disambiguation). platinum ← gold → mercury …   Wikipedia

• Solid solution — Fig. 1 A binary phase diagram displaying solid solutions over the full range of relative concentrations. A solid solution is a solid state solution of one or more solutes in a solvent. Such a mixture is considered a solution rather than a… …   Wikipedia